I-SV Thermal Conductive Two Component 1:1 electronic potting compound Sealant yeJunction Box

Inkcazo emfutshane:

I-SV electronic potting compound Sealant yenzelwe ukugalela amanzi kwaye ingangeni manzi kwi-LED driver, ballasts, kunye nee-reverse parking sensors.

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Iithegi zeMveliso

Ingcaciso yeMveliso

IIMBONAKALO

1. Ukukhanya okuphantsi, ukutyibilika okuhle, ukusasazwa kwamaqamza ngokukhawuleza.

2. Ubushushu obuhle kakhulu bombane kunye nokuqhuba ubushushu.

3. Ingafakwa nzulu embizeni ngaphandle kokuveliswa kwezinto eziphantsi kweemolekyuli ngexesha lokunyanga, inokuncipha okuphantsi kakhulu kwaye inamathela kakuhle kwizinto.

UKUPAKISHA
A:B =1:1

Inxalenye: 25 KG

Inxalenye B: 25 KG

UKUSETYENZISWA OKUSETYENZISWAYO

1. Ukufaka iimbiza kunye nokungangeni manzi kwi-LED driver, ii-ballast, kunye nee-sensors zokupaka ezingasemva.

2. Imisebenzi yokwambathisa, ukuqhuba ubushushu, ukuthintela ukufuma, kunye nokulungisa ezinye izinto ze-elektroniki

IIPROPATI EZIQHELEKILEYO

La maxabiso awenzelwanga ukusetyenziswa ekulungiseleleni iinkcukacha

IMPAHLA	A	B
Ngaphambi koMxube	Inkangeleko	Mhlophe	Mnyama
(25℃,65%RH)	Ukuqaqamba	2500±500	2500±500
	Uxinano (25℃, g/cm³)	1.6±0.05	1.6±0.05
Emva kokuxuba	Umlinganiselo Wokulinganisela (Ngobunzima)	1	1
(25℃,65%RH)	Umbala	Ngwevu
	Ukuqaqamba	2500~3500
	Ixesha Lokusebenza (umzuzu)	40~60
	Ixesha Lokuphilisa (H, 25℃)	3~4
	Ixesha Lokuphilisa (H, 80℃)	10~15
Emva kokunyanga	Ubunzima (uLwandle A)	55±5
(25℃,65%RH)	Amandla okuThamba (i-Mpa)	≥1.0
	Ukuqhuba kwe-Thermal (W/m·k)	≥0.6~0.8
	Amandla eDielectric (KV/mm)	≥14
	I-Dielectric Constant (1.2MHz)	2.8~3.3
	Ukumelana nomthamo (Ω·cm)	≥1.0×1015
	I-Coefficient yoLwandiso oluLula (m/m·k)	≤2.2×10-4
	Ubushushu bokusebenza (℃)	-40~100