SV Two Component 1:1 electronic potting compound iSealant
Ingcaciso yeMveliso
IIMBONAKALO
1. I-viscosity ephantsi, i-fluidity enhle, ukuchithwa kwe-bubble ngokukhawuleza.
2. I-insulation yombane egqwesileyo kunye ne-heat conduction.
3. Inokuthi ibe yimbiza enzulu ngaphandle kokuveliswa kwezinto eziphantsi ze-molecular ngexesha lokunyanga, inokuncipha okuphantsi kakhulu kunye nokunamathela okugqwesileyo kumacandelo.
UKUPAKISHA
A:B =1:1
Inxalenye: 25KG
B inxalenye: 25 KG
UKUSETYENZISWA ESISISEKO
1. Ukubumba kunye nokungangeni kwamanzi kumqhubi we-LED, ii-ballasts, kunye ne-reverse sensors yokupaka.
2. I-Insulation, i-thermal conduction, i-mswakama-proofing, kunye nemisebenzi yokulungiswa kwamanye amacandelo e-elektroniki
IIPROPATI EZIQHELEKILEYO
La maxabiso awenzelwanga ukusetyenziswa ekulungiseleleni iinkcukacha
| IPROPATI | A | B | |
| Phambi koMxube | Imbonakalo | Mhlophe | Mnyama |
| (25℃,65%RH) | Viscosity | 2500±500 | 2500±500 |
| Ubuninzi (25℃, g/cm³) | 1.6±0.05 | 1.6±0.05 | |
| Emva kokuxutywa | Umyinge weReyishini (Ngobunzima) | 1 | 1 |
| (25℃,65%RH) | Umbala | Ngwevu | |
| Viscosity | 2500~3500 | ||
| Ixesha lokusebenza (min) | 40~60 | ||
| Ixesha lokunyanga (H, 25℃) | 3~4 | ||
| Ixesha lokunyanga (H, 80℃) | 10–15 | ||
| Emva kokuThuthukiswa | Ukuqina (Unxweme A) | 55±5 | |
| (25℃,65%RH) | Amandla Okuqina (Mpa) | ≥1.0 | |
| I-Thermal Conductivity (W/m·k) | ≥0.6~0.8 | ||
| Amandla eDielectric (KV/mm) | ≥14 | ||
| IDielectric Constant (1.2MHz) | 2.8~3.3 | ||
| Ukuxhathisa uMqulu (Ω·cm) | ≥1.0×1015 | ||
| I-Coefficient of Linear Expansion (m/m·k) | ≤2.2 × 10-4 | ||
| Ubushushu bokusebenza (℃) | -40 ~ 100 | ||
Bhala umyalezo wakho apha kwaye uwuthumele kuthi
